These companies currently use 300-mm (12-inch) wafers for processors. Switching to the larger size will allow the companies to more than double the amount of processor that can be put on a single wafer.

Samsung Electronics is the world's number one memory semiconductor chip maker, Intel is the world's top non-memory semiconductor chip maker, and TSMC is the world's largest independent semiconductor foundry. The cooperation agreement between the three giants will likely further widen the technology gap between the leaders and latecomer rivals.

Samsung Electronics on Tuesday said the three companies agreed to cooperate to switch to 450-mm wafers to sustain the growth of the semiconductor industry and cut production costs.

They agreed to work together in developing the necessary equipment and building infrastructure with a view to putting a pilot production line for 450-mm wafers into operation in 2012.

Samsung said the cooperation is meaningful not only in that it should allow the three to secure a dominant position in the future chip market, but in suggesting guidelines for semiconductor equipment makers and material suppliers.

Bob Bruck, vice president and general manager of Technology Manufacturing Engineering in Intel's Technology and Manufacturing Group, said, "There is a long history of innovation and problem solving in our industry that has delivered wafer transitions resulting in lower costs per area of silicon processed and overall industry growth. The transition to 450-mm wafers will follow the same pattern of delivering increased value to our customers."

(englishnews@chosun.com )