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With regards to the Intel Corporation, Samsung Electronics's and LG Electronics's reactions have been quite contrary to each other. While Samsung pushed on for a "change of generation" in the semiconductor business -- challenging Intel, the dominant power in this field -- LG strengthened its cooperation with Intel.
Samsung announced Wednesday that it hosted the first Samsung Mobile Solution (SMS) Forum in Taiwan. During the meeting, Samsung released newly developed mobile phone parts such as the mobile processor flash memory chip for direct-dial in (DDI) image sensor and Samsung cellular phones and PDA. Samsung compared its forum with the Intel Developer Forum, showing Samsung's determination to lead the global mobile era.
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Challenging Intel Corporation, Samsung Electronics head Hwang Chang-kyu (left) says Wednesday that Samsung¡¯s mobile products would be the center of the future semiconductor industry. On the other hand, LG Electronics (right) entered into a memorandum of understanding (MOU) on Mar. 8 with Intel promoting joint "home network" research and development.
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Samsung Electronics Memory Chip Department Hwang Chang-kyu said in his opening speech that so far, the memory chip industry was lead by the developer of server and personal computers (PC). Before and after 2005, however, mobile products and digital consumer items would lead the memory chip industry, Hwang said. In other words, it could mean that Intel's PC era would now shift to a new era of Samsung's mobile technology.
A brand new product by Samsung was introduced, a fusion memory chip called ¡°One-NAND¡± which combined NAND and NOR flash memory into one. Previously, Samsung was the number one NAND maker in the world while Intel ran first in developing NOR. "One-NAND" was basically a symbol of strength for Samsung wanting to take the number one spot for both NAND and NOR, Samsung official said. Samsung said that it plans to host the forum annually expanding it to Japan, China and to parts of Europe.
While Samsung supposedly stood face to face with Intel, LG assured Intel of intensified cooperation.
LG Electronics said Wednesday that it entered into a memorandum of understanding (MOU) with Intel in relation to "home network" research and development (R&D).
LG Electronics is to send researchers to participate Intel's "home network" project which would build its R&D center in Korea. Both firms would join hands in technological development and mobile standardization. LG Electronics official said that both parties have also tentatively agreed to support each other in other fields relating to display memory chips and wireless LAN. LG Electronics previously had entered into contract with Intel in August 2000 concerning patent rights.
(Hwang Dae-jin, djhwang@chosun.com )
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